Meh.....
I got another phone call yesterday :roll:.
After another 11 hours MW2 marathon session :wooha: his PS3 had YLOD'd again, despite my warnings to him not to overdo it again

. An attempted second reflow wasn't successful, so it's looking more like a re-ball and rework of the BGA chips. It appears that for now, I now am the owner of a broken 40Gb PS3 base unit....
:help: :sos :help:
Now, I am 'sort of' up for this, as I reckon my trusty Black & Decker and I can get the chip removed and the pads cleaned up for a re-ball and reflow. There are a couple of Youtube videos where guys have reballed the chips using a soldering iron, however my concern is that if I can't get the solder on the pads 100% equal and level, the chip may move as I heat it up to re-attach it and it could screw the job up. I am thinking that this task is at least an 8 out of 10 difficulty rating and should only be attempted by people who are really competent at soldering and SMD work.
I could get 0.6mm solder balls from Fleabay and get a better result, if the soldering iron approach is a no-go.
Overall, my questions to Zetr0, rkauer and the other soldering Jedi on here are these..
1. Is a manual reball of the BGA chips even worth attempting, given the potential difficulty?
2. Should I attempt this, given the risk of a screw-up?
3. What do you reckon is the risk of loosening the links / resistors on the bottom of the BGA chip, whist removing it for re-balling?
What do you think.....??? Your advice would be really valued.
Thanks