@Steve / MerlinKV
well my friends, this really comes down to practice, however here is a simple guide that might help.
1. Flux
Not because I love the stuff, this time its VERY important to get the right one, we are dealing with heavy ground planes - much like a PSU, so we need a Flux Paste - most paste's have a higher vaporization point - thus it can do some good when the temperature gets high.
I would avoid liquid fluxes as most of these evaporate at about 280c.
2. Heat
You are going to need a lot of this, no joke here, these anchors of the RF unit are meant to be permanent.
Start off at about 340c - gently oscillate the head of the hot are gun around the area, don't keep it in place for more than a few seconds or you run the risk of blistering the PCB. After about 3 minutes you should increase the temperature to about 380/400c pending. remember the hotter you go - the more you have to keep moving the hot-air gun nozzle.
you should have a solder sucker to at least attempt to remove the solder from anchors, you probably wont get all of it so you need a thin terminal screw driver placed inside the RF phone socket and as the solder in the anchors melt, you very gently push down.
with luck it will pop off and leave just the 3 simple through hole signal pickups (ground, chroma, luma)
Just gently run the hot air over these and suck up the solder and the RF unit should fall out. Allow the PCB to cool for a few minutes, and then clean the area with IPA or diluted IPA.
r0jaws documented the above process in this post from his PPC thread
Its also where I shamelessly ninja'd the picture from too =)
well my friends, this really comes down to practice, however here is a simple guide that might help.
1. Flux
Not because I love the stuff, this time its VERY important to get the right one, we are dealing with heavy ground planes - much like a PSU, so we need a Flux Paste - most paste's have a higher vaporization point - thus it can do some good when the temperature gets high.
I would avoid liquid fluxes as most of these evaporate at about 280c.
2. Heat
You are going to need a lot of this, no joke here, these anchors of the RF unit are meant to be permanent.
Start off at about 340c - gently oscillate the head of the hot are gun around the area, don't keep it in place for more than a few seconds or you run the risk of blistering the PCB. After about 3 minutes you should increase the temperature to about 380/400c pending. remember the hotter you go - the more you have to keep moving the hot-air gun nozzle.
you should have a solder sucker to at least attempt to remove the solder from anchors, you probably wont get all of it so you need a thin terminal screw driver placed inside the RF phone socket and as the solder in the anchors melt, you very gently push down.
with luck it will pop off and leave just the 3 simple through hole signal pickups (ground, chroma, luma)
Just gently run the hot air over these and suck up the solder and the RF unit should fall out. Allow the PCB to cool for a few minutes, and then clean the area with IPA or diluted IPA.
r0jaws documented the above process in this post from his PPC thread
Its also where I shamelessly ninja'd the picture from too =)
